A Guide to Lead-free Solders: Physical Metallurgy and by John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing.

By John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. (eds.)

While tin/lead solders have ruled the electronics for a few years, environmental concerns and new laws are forcing swap. sponsored via greater than ten years of study in Pb-free solders, many electronics brands are poised for conversion.

A advisor to Lead-free Solders is meant as a device to assist because it strikes right into a new period within the construction and use of solders. an outline of the rules of soldering expertise is equipped starting with the idea underlying every one inspiration. targeting the main up to date equipment for checking out and characterization, those theories are then strengthened by means of experimental examples and commercial applications.

• Addresses key concerns in meeting from a fabrics element of view.

• supplies the reader handy entry to information crucial for the correct evaluate and employment of state-of-the-art ternary Sn/Ag/X solders

• permits comparability of the functionality of Pb-free solders with that of ordinary eutectic SnPb.

Although basically of curiosity to specialist layout and reliability engineers operating in electronics meeting and production, A advisor to Lead-free Solders can be precious for graduate scholars seeking to follow services in fabrics, mechanical or digital engineering during this undefined. Researchers in electronics and fabrics will locate the most recent study at their fingertips including the most likely instructions will desire from such learn within the future.

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Extra resources for A Guide to Lead-free Solders: Physical Metallurgy and Reliability

Sample text

Several critical properties of solder paste affect successful joint formation; among the most important are particle morphology, metal loading and rheological behavior, all of which in turn affect paste performance. 8. edu/) accurately the paste can be deposited, the slumping resistance, wettability to the substrate and solder-ball formation. Solder pastes are normally made with fully alloyed solder powder. The shape and size distribution in this powder determines the surface condition, which affects the behavior of the paste during reflow soldering (Judd and Brindley 1992).

4, show that particle size and metal loading have a significant effect on slumping behavior: these two factors were statistically significant at a confidence limit of 90%. The negative sign of these parameters indicates that larger particle sizes and greater metal loading reduce slumping. However, these parameters interact with flow characteristics to define the minimum pitch that can be achieved when stenciling a particular pattern. 2) is not highly predictive, the significance of the effects is clear.

Munie, G. , Plewes, J. , Socolowski, N. , (1992), “An Assessment of the Use of Lead in Electronic Assembly”, National Surface Mount Council, IPC, Chicago, IL. , (1998) “Global Update on Lead Free Solders”, Proc. Surface Mount International 1998, IPC, pp 705709. , Telefonaktiebolaget LM Ericsson, Stockholm, (February 1983), “Creep and Fatigue Testing of Micro Solder Joints”, Proc. of 7th Annual Soldering Technology Symposium, Naval Weapons Center, China Lake, CA. , (1997) “World’s First Lead Free Circuit Telephone”, Proc.

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